Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron

Product Details
Customization: Available
Material: Polishing Powder
Usage: Polishing, Grind
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Registered Capital
5000000 RMB
Plant Area
501~1000 square meters
  • Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron
  • Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron
  • Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron
  • Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron
  • Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron
  • Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron
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Basic Info.

Model NO.
REP-21
Customized
Customized
Color
White
Product Name
Polishing Powder
Other Name
Abrasive Powder
Appearance
White Yellowish Powder
Main Content
Cerium Oxide
Treo
98%
CEO2/Treo
99.95%
F Content
0
Particle Size D50
0.6 Micron
Particle Size D100
5 Micron
Solubility in Water
Insoluble
Transport Package
1000kg/Bag
Specification
cerium oxide polishing powder
Trademark
Wanfeng
Origin
Jiangxi, China
HS Code
2846101000
Production Capacity
500metric Tons/Month

Product Description

Stable Pure Cerium Oxide Polishing Powder with D50 0.6 micron

Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron

Code: REP-21

Name: Cerium Oxide Polishing Powder

TREO:  ≥ 98%

CeO2/TREO: 99.95%

Color: white

F: 0

PH: 7

Particle size: D50:0.6±0.2μm, D100<5μm

Appearance: white yellowish powder
 

Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron 

Characteristics:

1. With great cutting force and long service life, the polishing speed is fast;

2. With good suspension and dispersion, there is non adhesion and easy cleaning.

3. With good consistency, the particle size distribution is uniform.

4. With excellent hand feel and stable quality, it will create no scratch.

 

Application:
1. For precision polishing of larger flat crystal and diamond products.
2. For the polishing of optical components and mobile covers with general precision requirements.
3. For the polishing of mobile phone covers, flat glass or optical glass with higher precision requirements. For example, the polishing of glass substrates for TFT-LCD.
4. For the precision polishing of optical components, silicon wafers and large glass covers with high precision requirements. 
5. For the polishing of large flat glass, silicon wafers and optical glass with higher precision requirements.
6. For precision polishing of optical components with high precision requirements, or polishing of large LCD screen.

Tips:
1. The polishing by the polishing slurry with the concentration of 10% can get higher polishing efficiency and quality.
2. This product shall be stored in a cool dry place.


Specifications

Rare Earth Polishing Powder

Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron

Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron

Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron
Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron
Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron

Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron

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