Ceria Polishing Powder

• Classification: Cerium Oxide
• Grade Standard: Industrial Grade
• Kind: No Salt Oxide
• Quality: First Class
• Transport Package: 800kg, 850kg, 900kg or 1000kg Net Weight for Each
• Specification: D50: 1.7-2.3um
• Model NO.: REP-05S
• Trademark: Wanfeng
• Origin: China
• HS Code: 284690
• Production Capacity: 500tons/Month

Product Description

Ceria polishing powder   


Specifications of Ceria polishing powder   :

*Appearance: white powder

*Code: REP-05

*TREO:  ≥ 95%

*CeO₂/TREO: 70±5%

*La2O3/TREO : 30±5%

*Pr6O11/TREO : <0.01%

*F: 3-7%

*PH: 7

*Particle size: D50: 2.0±0.3 μm, D100<10μm

 

Code	TREO	CeO2	La2O3	Pr6O11	D50(μm)	D100(μm)	Color	F(%)	PH
REP-01	≥95%	70±5%	30±5%	<0.01%	0.6±0.2	<5	White	3-7	7
REP-02	≥95%	70±5%	30±5%	<0.01%	1.0±0.2	<6	White	3-7	7
REP-03	≥95%	70±5%	30±5%	<0.01%	1.3±0.3	<7	White	3-7	7
REP-04	≥95%	70±5%	30±5%	<0.01%	1.5±0.3	<8	White	3-7	7
REP-05	≥95%	70±5%	30±5%	<0.01%	2.0±0.3	<10	White	3-7	7
REP-06	≥95%	70±5%	30±5%	<0.01%	2.8±0.4	<12	White	3-7	7
REP-11	≥95%	65±5%	30±5%	1%~5%	0.6±0.2	<5	Red	3-7	7
REP-12	≥95%	65±5%	30±5%	1%~5%	1.0±0.2	<6	Red	3-7	7
REP-13	≥95%	65±5%	30±5%	1%~5%	1.3±0.3	<7	Red	3-7	7
REP-14	≥95%	65±5%	30±5%	1%~5%	1.5±0.3	<8	Red	3-7	7
REP-15	≥95%	65±5%	30±5%	1%~5%	2.0±0.3	<10	Red	3-7	7
REP-16	≥95%	65±5%	30±5%	1%~5%	2.8±0.4	<12	Red	3-7	7
REP-21	≥98%	≥99.95%	<0.03%	<0.01%	0.6±0.2	<5	White	0	7
REP-22	≥98%	≥99.95%	<0.03%	<0.01%	1.0±0.2	<6	White	0	7
REP-23	≥98%	≥99.95%	<0.03%	<0.01%	1.5±0.3	<8	White	0	7
REP-24	≥98%	≥99.95%	<0.03%	<0.01%	2.0±0.3	<10	White	0	7
REP-25	≥98%	≥99.95%	<0.03%	<0.01%	3.0±0.5	<15	White	0	7
REP-26	≥98%	≥99.95%	<0.03%	<0.01%	4.0±0.5	<20	White	0	7

 

Applications :

1. For precision polishing of larger flat crystal and diamond products.
2. For the polishing of optical components and mobile covers with general precision requirements.
3. For the polishing of mobile phone covers, flat glass or optical glass with higher precision requirements. For example, the polishing of glass substrates for TFT-LCD.
4. For the precision polishing of optical components, silicon wafers and large glass covers with high precision requirements. 
5. For the polishing of large flat glass, silicon wafers and optical glass with higher precision requirements.
6. For precision polishing of optical components with high precision requirements, or polishing of large LCD screen.